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| Categories | Semiconductor Equipment |
|---|---|
| Brand Name: | ZMSH |
| Place of Origin: | SHANGHAI,CHINA |
| MOQ: | 1 |
| Payment Terms: | T/T |
| Delivery Time: | 2-4WEEKS |
| Maximum Workpiece Size: | ∅310*500mm |
| Main Roller Coating Diameter: | ∅350*510mm (Dual Conical Design) |
| Diamond Wire Diameter: | 0.1-0.5mm |
| Diamond Wire Speed: | 2500 meters per minute (Max) |
| Cutting Thickness Range: | 0.1mm - 20mm |
| Cutting Accuracy: | 0.01mm |
| Cutting Method: | Material swings and descends from top to bottom, while diamond wire remains stationary |
| Cutting Fluid: | High-efficiency anti-rust cutting fluid |
| Max Cutting Tension: | 0-80N (Adjustable in 0.1N increments) |
| Swing Angle: | ±8° |
| Company Info. |
| SHANGHAI FAMOUS TRADE CO.,LTD |
| Verified Supplier |
| View Contact Details |
| Product List |
12-Inch High-Speed Diamond Wire Cutting Machine for Sapphire, SiC, Ceramics, and More
Product Overview:
The Machine is a high-speed, high-precision diamond wire multi-wire
cutting machine developed for cutting 12-inch semiconductor
sapphire substrates. It is widely applicable for large-sized and
ultra-thin cutting of materials such as silicon carbide (SiC),
sapphire, ceramics, precious metals, quartz, and optical glass.
This cutting-edge equipment is designed to deliver exceptional
precision, speed, and efficiency, making it ideal for industries
such as semiconductor, optics, electronics, and other
high-precision manufacturing fields.
Key Features:
Maximum Cutting Size: Capable of cutting up to 12 inches (∅310*500mm) of material.
High Speed and Precision: The diamond wire operates at a maximum speed of 2500 meters per minute, with a cutting accuracy of 0.01mm, ensuring high efficiency and precision for advanced manufacturing.
Swinging Cutting Method: The material swings and descends from top to bottom while the diamond wire remains stationary, providing smooth and accurate cuts.
Multi-Wire Cutting: The machine supports multi-wire cutting technology, significantly enhancing production efficiency.
Wide Cutting Thickness Range: The cutting thickness ranges from 0.1mm to 20mm, making it versatile for a wide range of applications.
Technical Specifications:
| Item | Parameter |
|---|---|
| Maximum Workpiece Size | ∅310*500mm |
| Main Roller Coating Diameter | ∅350*510mm (Dual Conical Design) |
| Diamond Wire Diameter | 0.1-0.5mm |
| Diamond Wire Speed | 2500 meters per minute (Max) |
| Cutting Thickness Range | 0.1mm - 20mm |
| Cutting Accuracy | 0.01mm |
| Cutting Method | Material swings and descends from top to bottom, while diamond wire remains stationary |
| Cutting Fluid | High-efficiency anti-rust cutting fluid |
| Max Cutting Tension | 0-80N (Adjustable in 0.1N increments) |
| Swing Angle | ±8° |
| Swing Speed | 0.83°/s |
| Cutting Feed Speed | 0.01-10mm/min |
| Water Tank Capacity | 300L |
| Workstation Vertical Stroke | 350mm |
| Power Supply | Three-phase five-wire AC380V/50Hz |
| Total Power | ≤113kW |
| Main Motor (Water Cooling) | 32*2KW |
| Wire Release Motor | 2KW |
| Workstation Lifting Motor | 0.4KW |
| Tension Control Motor (Water Cooling) | 5.5*2KW |
| Wire Storage and Collection Motor | 15*2KW |
| External Dimensions (Excluding Rocker Arm Box) | 2700 x 1650 x 3050mm |
| External Dimensions (Including Rocker Arm Box) | 2950 x 1650 x 3104mm |
| Machine Weight | 8200kg |
Applications:
The Machine is designed for high-precision cutting in industries
such as semiconductors, optics, and precious metal processing. It
is ideal for large-scale, ultra-thin cutting of hard and brittle
materials such as sapphire and silicon carbide (SiC), offering both
precision and efficiency for advanced manufacturing needs. This
cutting machine provides excellent performance in both research and
high-volume production environments.
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