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BQ24311DSGR Electronic Integrated Circuits FPGA Board Components

Categories Electronic IC Chip
Brand Name: Texas Instruments
Model Number: BQ24311DSGR
Certification: /
Place of Origin: N/S
MOQ: 1PCS
Price: Negotiation
Payment Terms: T/T
Supply Ability: 9999999+PCS
Delivery Time: 2-7 work days
Manufacturer Package: 8-WFDFN Exposed Pad
Fault Protection: Over Current, Over Temperature, Over/Under Voltage
Popularity: High
Function: Battery Protection
Battery Chemistry: Lithium-Ion
Temperature Range - Operating: -40°C to 125°C
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BQ24311DSGR Electronic Integrated Circuits FPGA Board Components

BQ24311DSGR Electronic Components Integrated Circuits FPGA Board

ManufacturerTexas Instruments
PackagingReel
FunctionBattery Protection
Battery ChemistryLithium-Ion
Fault ProtectionOver Current, Over Temperature, Over/Under Voltage
Temperature Range - Operating-40°C ~ 125°C
Manufacturer Package8-WFDFN Exposed Pad
Supplier Device Package8-WSON (2x2)
Part Number SeriesBQ24311
Manufacturer Pack Quantity3,000
MSL Level2 (1 Year)
PopularityHigh
Fake Threat In the Open Market77 pct.
Supply and Demand StatusBalance

Features


• Provides Protection for Three Variables:

Input Overvoltage, with Rapid Response in < 1

User-Programmable Overcurrent with Current Limiting

Battery Overvoltage

• 30 V Maximum Input Voltage

• Supports up to 0.3 A Input Current

Robust Against False Triggering Due to Current Transients

Thermal Shutdown

Enable Input

Status Indication – Fault Condition


Applications


Mobile Phones and Smart Phones

PDAs

MP3 Players

Low-Power Handheld Devices

Bluetooth™ Headsets


Description


The bq24311 is a highly intergrated circuit designed to protect Li-ion batteries from charging circuits failures. The IC continously monitors the input voltage, input current, and battery voltage. The input overvoltage protection immediately removes power from the charging circuit by turning off an internal switch. The input protection limits the system current at the user-programmable value, and if the overcurrent persists, switches the pass element OFF after a blanking period. Addtionally, the IC also monitors its own die temperature and switches off if it becomes too hot.


The IC can be controlled by a processor and also provides status information about fault conditions to the host.


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