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Pulsed Laser Deposition PLD Systems Sputter Target for DC RF Magnetron Sputtering Systems

Categories Technical Ceramic Parts
Brand Name: ZG
Model Number: MS
Certification: CE
Place of Origin: CHINA
MOQ: 1 piece
Price: USD10/piece
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability: 10000 pieces per month
Delivery Time: 3 working days
Packaging Details: Strong wooden box for Global shipping
Application: Pulsed Laser Deposition ( PLD ) systems and DC or RF Magnetron Sputtering Systems
Diameter: Ø 1" / Ø 2" / Ø 3" / Ø 4"/ Ø 6" / Ø 8"
Thickness: 3-6mm
Grade: SAW grade and optical grade
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Pulsed Laser Deposition PLD Systems Sputter Target for DC RF Magnetron Sputtering Systems


Sputter Target for Pulsed Laser Deposition ( PLD ) systems and DC or RF Magnetron Sputtering Systems


We provides a wide range of sputter target including Metal , Alloy , Rare earth , Single crystal , Compound , and various ceramic target , such as Oxide , Nitride , Carbide , Boride , Sulfide , Selenide and Telluride sputter target .We provide a complete line of sputtering target materials suitable for Pulsed Laser Deposition ( PLD ) systems and DC or RF Magnetron Sputtering Systems , These targets can be fabricated to fit all sputtering systems including round , rectangular , S-Gun , Delta , and Ring . Sputter target can be fabricated in round or square shape , with back plate or without back plate depands on the sputtering system and target material you have , our standard size from 1" to 12 " in diameter , thickness range from 1 mm , 3 mm to 6 mm , in single or multiple-piece construction . In addition , we can offer custom specifications designed to your unique needs including , dimension , thickness , purity , density , uniform grain size , composition rate , and different back plate . We have various sputter targets in stock and can machine to your specification with good quality . Contact us for more information .

Manufacture MethodApplication field
Vacuum hot pressingSemiconductor
Hot isostatic pressingData storage
Cold isostatic pressingOptoelectronics
Vacuum sinteringFlat panel display
Vacuum arc meltingSolar cell

Product Specification


Purity99.9% / 99.99% / 99.999%
DiameterØ 1" / Ø 2" / Ø 3" / Ø 4"/ Ø 6" / Ø 8"
Thickness3 mm ~ 6 mm
Back plateOFHC copper
BondingIndium / Ag epoxy
PackageVacuum sealed

1. Boride Sputter Target

CrB, FeB, HfB2, LaB6, MgB2, Mo2B5 ,NbB, SmB6, TaB, TiB2, WB, VB, VB2, ZrB2


2. Carbide Sputter Target

B4C, Cr3C2, HfC, Mo2C, NbC, SiC, TaC, TiC, TiCN, VC, WC, VC, ZrC


3. Fluoride Sputter Target

BaF2, CaF2, CeF3, FeF2, KF, LaF3, PbF2, MgF2, NaF


4. Nitride Sputter Target

AlN, BN, CrN, GaN, HfN, InN, NbN, NbCrN, Si3N4, TaN, TiN, VN, ZnN, ZrN, ZrCN


5. Oxide Sputter Target

Al2O3, ATO, AZO, BaTiO3, BSCCO, BST, CeO2, CuO, Cr2O3,Fe2O3, HfO2, In2O3, ITO, IZO, IZGO, IZTO, LaAl2O3, LaSrMnO3, LiNbO3, MgO, MoO3, NiO, Nb2O5, PbTiO3, PZT, Sb2O3, SiO, SiO2, SnO2, SrRuO3, SrTiO3, Ta2O5, TiO2, SnO2, V2O5, WO3, Y2O3, Yb2O3, YBCO, YSZ, ZnO, ZAO, ZGO, ZIO, ZTO


6. Selenide Sputter Target

Al2Se3, Bi2Se3, CdSe, CuSe, Cu2Se, FeSe2, GeSe, In2Se3, MoSe2, MnSe, NbSe2, PbSe, Sb2Se3, SnSe, TaSe2, WSe2, ZnSe


7. Silicide Sputter Target

CoSi2, CrSi2, FeSi2, HfSi2, MoSi2, NbSi2, NiSi2, TaSi2, TiSi2, WSi2, VSi2, ZrSi2


8. Sulphide Sputter Target

CdS, CuS, Cu2S, FeS2, GaS, GeS, In2S3, PbS, MoS2, NiS, TiS2, Sb2S3, SnS, WS2, ZnS


9. Telluride Sputter Target

Al2Te3, Bi2Te3, CdTe, CuTe, GaTe, Ga2Te3, GeTe, PbTe, MnTe, MoTe2, NbTe2, TaTe2, SbTe, SnTe, WTe2, ZnTe


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