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0.07mm Ultra Fine Round Copper Wire Self Bonding Wire For Mobile Sensor

0.07MM ULTRA FINE ROUND COPPER WIRE SELF BONDING WIRE FOR MOBILE SENSOR

There are dozens of sensors in smart phone, that is help us to realize a lot of functions.The tiny part need ultra fine self bonding wire, and most use 0.07mm or AWG41 size

FEATURES AND BENEFITS

Good resistance to refrigerant and freon
Suitable for windings that are subjected to constantly high temperature and mechanical stress
Good chemical resistance
Outstanding mechanical and chemical property
Low soldering temperature

CERTIFICATES
ISO 9001-2000, ISO TS 16949, ISO 14001-2004,UL Approved, RoHS Directive Met

Specification

Size	Conductor	Insulation Thickness	Bonding Layer thickness	O.D	DCR (at 20℃)	Breakdown voltage (V)	Elongation	Bonding Strength(g)
0.012	0.012	According to DCR	Min0.001	Min0.0005	0.014mm	128.85-179.96	Min100	Min3.0
0.015	0.012	According to DCR	Min0.001	Min0.0005	0.020mm	85.06-111.10	Min120	Min5.0
0.02	0.02	±0.001	Min0.001	Min0.002	Max0.0260	54.0~57.0	Min135	Min6.0
0.025	0.025	±0.001	Min0.002	Min0.002	Max0.0320	34.0~37.0	Min165	Min6.0
0.028	0.028	±0.001	Min0.002	Min0.002	Max0.0360	26.9~28.4	Min190	Min6.0
0.03	0.03	±0.001	Min0.002	Min0.002	Max0.0390	23.7~24.9	Min210	Min6.0
0.032	0.032	±0.001	Min0.002	Min0.002	Max0.0400	21.5~22.5	Min210	Min6.0
0.034	0.034	±0.001	Min0.002	Min0.002	Max0.0430	18.1~18.9	Min250	Min6.0
0.035[D]	0.035	±0.001	Min0.002	Min0.002	Max0.0460	17.5~18.6	Min250	Min6.0
0.037[D]	0.037	±0.001	Min0.002	Min0.002	Max0.0480	16.2~16.8	Min275	Min6.0
0.038[D]	0.038	±0.001	Min0.002	Min0.002	Max0.0490	15.5~16.0	Min275	Min7.0
0.039	0.039	±0.001	Min0.002	Min0.002	Max0.049	14.6~15.2	Min100	Min7.0
0.040[D]	0.04	±0.001	Min0.002	Min0.002	Max0.050	13.0~14.5	Min100	Min7.0
0.041	0.041	±0.001	Min0.003	Min0.003	Max0.0500	12.9~13.6	Min275	Min7.0
0.042[D]	0.042	±0.001	Min0.003	Min0.003	Max0.0530	12.2~13.0	Min275	Min7.0
0.043[D]	0.043	±0.001	Min0.003	Min0.003	Max0.0520	11.4~12.5	Min275	Min7.0
0.044[D]	0.044	±0.001	Min0.003	Min0.003	Max0.0540	11.4~12.5	Min275	Min7.0
0.07	0.07	±0.002	Min0.003	Min0.003	Max0.086	4.30~4.50	Min700	Min12.0

Product Tags:

self solderable copper wire

covered copper wire

0.07mm Ultra Fine Round Copper Wire Self Bonding Wire For Mobile Sensor

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Categories	Self Bonding Wire
Brand Name:	Rvyuan
Model Number:	0.07mm
Certification:	UL
Place of Origin:	China
MOQ:	Different types with differet MOQ
Price:	Negotiation
Payment Terms:	Negotiation, T/T, L/C
Supply Ability:	Satisfy your demand
Delivery Time:	2-15 workding days
Packaging Details:	Spool with carton
Standard:	IEC/JIC/NEMA
Material:	Round Copper
Bonding methoud:	Hot wind/Solvent
Conductor:	Copper
Thermal Class:	155/180
Soldering temperature:	320℃