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LCMXO2-1200HC-4TG100C Field Programmable Gate Array IC 79 65536 1280 100-LQFP

Categories Integrated Circuit Chip
Brand Name: Original
Model Number: LCMXO2-1200HC-4TG100C
Certification: Original
Place of Origin: Original
MOQ: 1
Price: Negotiation
Payment Terms: TT
Supply Ability: 100
Delivery Time: 3-4days
Packaging Details: carton box
Number of LABs/CLBs: 160
Number of Logic Elements/Cells: 1280
Total RAM Bits: 65536
Number of I/O: 79
Voltage - Supply: 2.375V ~ 3.465V
Operating Temperature: 0°C ~ 85°C (TJ)
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LCMXO2-1200HC-4TG100C Field Programmable Gate Array IC 79 65536 1280 100-LQFP

LCMXO2-1200HC-4TG100C Field Programmable Gate Array IC 79 65536 1280 100-LQFP

Chips from factories. All are new and original. Pls inform us the part number and qty when to inquiry.

Specifications of LCMXO2-1200HC-4TG100C

TYPEDESCRIPTION
CategoryIntegrated Circuits (ICs)
Embedded
FPGAs (Field Programmable Gate Array)
MfrLattice Semiconductor Corporation
SeriesMachXO2
PackagingTray
Number of LABs/CLBs160
Number of Logic Elements/Cells1280
Total RAM Bits65536
Number of I/O79
Voltage - Supply2.375V ~ 3.465V
Mounting TypeSurface Mount
Operating Temperature0°C ~ 85°C (TJ)
Package / Case100-LQFP
Supplier Device Package100-TQFP (14x14)
Base Product NumberLCMXO2-1200

Features of LCMXO2-1200HC-4TG100C


• Flexible Logic Architecture
• Six devices with 256 to 6864 LUT4s and 18 to 334 I/Os
• Ultra Low Power Devices
• Advanced 65 nm low power process
• As low as 22 µW standby power
• Programmable low swing differential I/Os
• Stand-by mode and other power saving options
• Embedded and Distributed Memory
• Up to 240 kbits sysMEM™ Embedded Block RAM
• Up to 54 kbits Distributed RAM
• Dedicated FIFO control logic
• On-Chip User Flash Memory
• Up to 256 kbits of User Flash Memory
• 100,000 write cycles
• Accessible through WISHBONE, SPI, I2C and JTAG interfaces
• Can be used as soft processor PROM or as Flash memory
• Pre-Engineered Source Synchronous I/O
• DDR registers in I/O cells
• Dedicated gearing logic
• 7:1 Gearing for Display I/Os
• Generic DDR, DDRX2, DDRX4
• Dedicated DDR/DDR2/LPDDR memory with DQS support
• High Performance, Flexible I/O Buffer
• Programmable sysIO™ buffer supports wide range of interfaces:
– LVCMOS 3.3/2.5/1.8/1.5/1.2
– LVTTL
– PCI
– LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL
– SSTL 25/18
– HSTL 18
– Schmitt trigger inputs, up to 0.5 V hysteresis
• I/Os support hot socketing
• On-chip differential termination
• Programmable pull-up or pull-down mode
• Flexible On-Chip Clocking
• Eight primary clocks
• Up to two edge clocks for high-speed I/O interfaces (top and bottom sides only)
• Up to two analog PLLs per device with fractional-n frequency synthesis
– Wide input frequency range (7 MHz to 400 MHz)
• Non-volatile, Infinitely Reconfigurable
• Instant-on – powers up in microseconds
• Single-chip, secure solution
• Programmable through JTAG, SPI or I2C
• Supports background programming of non-volatile memory
• Optional dual boot with external SPI memory
• TransFR™ Reconfiguration
• In-field logic update while system operates
• Enhanced System Level Support
• On-chip hardened functions: SPI, I2C, timer/counter
• On-chip oscillator with 5.5% accuracy
• Unique TraceID for system tracking
• One Time Programmable (OTP) mode
• Single power supply with extended operating range
• IEEE Standard 1149.1 boundary scan
• IEEE 1532 compliant in-system programming
• Broad Range of Package Options
• TQFP, WLCSP, ucBGA, csBGA, caBGA, ftBGA, fpBGA, QFN package options
• Small footprint package options
– As small as 2.5 mm x 2.5 mm
• Density migration supported
• Advanced halogen-free packaging



Environmental & Export Classifications of LCMXO2-1200HC-4TG100C

ATTRIBUTEDESCRIPTION
RoHS StatusROHS3 Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
REACH StatusREACH Unaffected
ECCNEAR99
HTSUS8542.39.0001

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