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bt fccsp package substrate

from 377 Products

BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly

China BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly on sale
FCCSP package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate......
HongRuiXing (Hubei) Electronics Co.,Ltd.

Address: Tianyue building 711,518100 shajing centre bao'an district Shenzhen city

2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive

China 2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive on sale
2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd

Address: Huishang Building, 19-128 Nathan Road, Yau Tsim Sha Tsui, Yau Tsim, Hong Kong

3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates

China 3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates on sale
...Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates......
JIMA Copper

Address: No.60 Guoxia Road, Yangpu District, Shanghai,China.

Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof

China Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof on sale
... Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ......
NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD

Address: Tengjin Technology Park,No.7,Huaguoshan Road,XinAn community,ChangAn,Dongguan,GuangDong,China.

IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate

China IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate on sale
Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited

Address: Room404,Building A2,Shunjing Pioneer Park,NO3 Longteng 3rd road, jixiang community,longcheng street,longgang district,ShenZhen, China

Sensor IC Substrate PCB With Components 18 Layer Circuit Board Maker

China Sensor IC Substrate PCB With Components 18 Layer Circuit Board Maker on sale
... / line spacing: 120 / 25um Surface technology: ENEPIG Plate thickness: 0.25mm Purpose: BGA IC packaging substrate Customized PCBs, also known as bespoke or tailor-made PCBs, are designed to meet specific requirements of a particular project, application,...
ONESEINE TECHNOLOGY CO.,LTD

Address: Address:Room624,Fangdichan development building,Guicheng south,Nanhai,Foshan,China

IC Integrated Circuits AM2432BSEFHIALXR FCCSP-293 Microcontrollers - MCU

China IC Integrated Circuits AM2432BSEFHIALXR FCCSP-293 Microcontrollers - MCU on sale
... Circuits AM2432BSEFHIALXR FCCSP-293 Microcontrollers - MCU Specifications Product Attribute Attribute Value Manufacturer: Texas Instruments Product Category: ARM Microcontrollers - MCU Series: AM2432 Mounting Style: SMD/SMT Package / Case: FCCSP-293 Core......
Shenzhen Zhongkaixin Micro Electronics Co., Ltd.

Address: Room 406-408, Shenfang C Building, Huaqiangbei Street, Futian District, Shenzhen, China

AM6252ATCGHAALW MPU HMI SoC With Arm Cortex-A53-Based Edge AI And Full-HD Dual Display FCCSP-425

China AM6252ATCGHAALW MPU HMI SoC With Arm Cortex-A53-Based Edge AI And Full-HD Dual Display FCCSP-425 on sale
... Cortex M4F Number of cores: 2 Core Data bus width: 64 bit Maximum clock frequency: 400 MHz Package/Case: FCCSP-425 Series: AM625 Installation style: SMD/SMT Minimum operating temperature: - 40 C Maximum operating temperature: +105 C...
Eastern Stor International Ltd.

Address: Room 4513, Block C, CEIEC Building, Huaqiang North Rd, Futian District, Shenzhen, Guangdong, China 518031

TX08DACP Wireless Communication Module 8-Channel Ultrasound Transmitter FCCSP-196 Package

China TX08DACP Wireless Communication Module 8-Channel Ultrasound Transmitter FCCSP-196 Package on sale
TX08DACP Wireless Communication Module 8-Channel Ultrasound Transmitter FCCSP-196 Package [MJD Advantage] + 15 years experience for electronic components + Secure Ordering + Excellent Feedback + Delivery Date Guaranteed + 100% ......
ShenZhen Mingjiada Electronics Co.,Ltd.

Address: 1239 New Asia Guoli Building Zhenzhong Road.,Futian district Shenzhen China

GS600SU GS600SUA Underfill Dispensing Machine for Die Form Underfill FCBGA FCCSP SIP Packaging CUF Application

China GS600SU GS600SUA Underfill Dispensing Machine for Die Form Underfill FCBGA FCCSP SIP Packaging CUF Application on sale
GS600SU Underfill Dispensing Machine for Die Form Underfi ll GS600 SU is a high- speed and high- precision automatic online dispensing system which is developed based on Underfill process requirements of FCBGA/FCCSP. The system strictly controls the product......
Changzhou Mingseal Robot Technology Co., Ltd.

Address: No. 18-98, Changwu Middle Road, Wujin District, Changzhou City, Jiangsu Province

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Products: GS600SU GS600SUA Underfill Dispensing Machine for Die Form Underfill FCBGA FCCSP SIP Packaging CUF Application

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