BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly
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FCCSP package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
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...Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates......
JIMA Copper
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Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof
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... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ......
NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited
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Sensor IC Substrate PCB With Components 18 Layer Circuit Board Maker
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... / line spacing: 120 / 25um Surface technology: ENEPIG Plate thickness: 0.25mm Purpose: BGA IC packaging substrate Customized PCBs, also known as bespoke or tailor-made PCBs, are designed to meet specific requirements of a particular project, application,...
ONESEINE TECHNOLOGY CO.,LTD
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IC Integrated Circuits AM2432BSEFHIALXR FCCSP-293 Microcontrollers - MCU
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... Circuits AM2432BSEFHIALXR FCCSP-293 Microcontrollers - MCU Specifications Product Attribute Attribute Value Manufacturer: Texas Instruments Product Category: ARM Microcontrollers - MCU Series: AM2432 Mounting Style: SMD/SMT Package / Case: FCCSP-293 Core......
Shenzhen Zhongkaixin Micro Electronics Co., Ltd.
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AM6252ATCGHAALW MPU HMI SoC With Arm Cortex-A53-Based Edge AI And Full-HD Dual Display FCCSP-425
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... Cortex M4F Number of cores: 2 Core Data bus width: 64 bit Maximum clock frequency: 400 MHz Package/Case: FCCSP-425 Series: AM625 Installation style: SMD/SMT Minimum operating temperature: - 40 C Maximum operating temperature: +105 C...
Eastern Stor International Ltd.
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TX08DACP Wireless Communication Module 8-Channel Ultrasound Transmitter FCCSP-196 Package
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TX08DACP Wireless Communication Module 8-Channel Ultrasound Transmitter FCCSP-196 Package [MJD Advantage] + 15 years experience for electronic components + Secure Ordering + Excellent Feedback + Delivery Date Guaranteed + 100% ......
ShenZhen Mingjiada Electronics Co.,Ltd.
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GS600SU GS600SUA Underfill Dispensing Machine for Die Form Underfill FCBGA FCCSP SIP Packaging CUF Application
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GS600SU Underfill Dispensing Machine for Die Form Underfi ll GS600 SU is a high- speed and high- precision automatic online dispensing system which is developed based on Underfill process requirements of FCBGA/FCCSP. The system strictly controls the product......
Changzhou Mingseal Robot Technology Co., Ltd.
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