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cellphone PCB High density pcb

Categories High Density Interconnect PCB
Place of Origin: china
Brand Name: dinglian
MOQ: 1pcs
Price: 1
Packaging Details: Standard
Delivery Time: 7
Payment Terms: TT
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    cellphone PCB High density pcb

    General Information for High density pcb (HDI PCB)


    HDI pcb is the abbreviation for High Density Interconnect pcb or High Density pcb.An HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB.
    HDI includes the use of fine features or signal traces and spaces of 0.003” (75 µm) or less and laser-drilled blind or buried microvia technology. Microvias allow the use of micro-interconnects from one layer to another within a PCB utilizing a smaller pad diameter creating additional routing density or reducing form factor.

    High Density PCB is used extensively in applications and industries including:

    ● Cell phone● GPS
    ● Telecom● ASemiconductor
    ● Automotive● Military
    ● Medical● Instrumentation

    1. 6L HDI printed circuit board for Intercom

    6L High density PCB (HDI PCB) for intercom
    Board dimensions: 110 x 166mm
    Finished board thickness: 1.2mm
    Material: FR-4 Tg150
    Minimum holes size: 0.1mm
    Minimum line width/clearance: 3.5/3.5mil
    Copper thickness: 1oz
    Solder mask: top and bottom (color: green)
    Silkscreen: top (color: white)
    Finish: immersion gold (top and bottom)
    Board stack up: 1 + 4 + 1

    2. 8L Cell phone HDI board PCB

    8layers High density PCB (HDI PCB) for cell phone
    Base material: FR4, Tg150
    Layer count: 8 layers (HDI PCB)
    Surface finishing: immersion gold
    Board thickness: 1.0mm
    Copper thickness: 0.5oz
    Minimum line width: 0.075mm
    Minimum line spacing: 0.075mm
    Laser drilling + blind and buried drilling Impedance control
    Stack up: 1+6+1

    3. 10L High density printed circuit board

    10layers HDI PCB
    Base material: FR4, Tg170
    Surface finishing: immersion gold
    Board thickness: 1.0mm
    Copper thickness: 0.5oz
    Minimum line width: 0.1mm
    Minimum line spacing: 0.1mm
    Laser drilling + blind and buried drilling Impedance control
    Board stack up: 1+8+1
    Impedance control

    4. 10L High Density Interconnect pcb

    10L High Density Interconnect board
    Laminate: FR4, Tg150
    Board thickness: 1.6mm
    Copper thickness: 17.5um (Hoz) for all layers
    Solder resist: green color
    Surface Finish: Immersion gold
    Trace width/width: 0.89/0.1mm
    Min. holes:0.1mm
    Controlled Impedance
    Board stack up: 1+1+6+1+1
    Application: Industry control

    Cheap cellphone PCB  High density pcb for sale
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